Semiconductor device containing a buried threshold voltage adjustment layer and method of forming

ABSTRACT

A method is provided for forming a semiconductor device containing a buried threshold voltage adjustment layer. The method includes providing a substrate containing an interface layer, depositing a first high-k film on the interface layer, depositing a threshold voltage adjustment layer on the first high-k film, and depositing a second high-k film on the threshold voltage adjustment layer such that the threshold voltage adjustment layer is interposed between the first and second high-k films. The semiconductor device containing a patterned gate stack is described.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.11/864,514, filed Sep. 28, 2007, and is related to co-pending U.S.patent application Ser. No. 11/688,675, filed on Mar. 20, 2007, andco-pending U.S. patent application Ser. No. 11/688,643, filed on Mar.20, 2007. The entire contents of each of these applications are herebyincorporated by reference.

FIELD OF INVENTION

The present invention relates to semiconductor devices containingpatterned gate stacks with high dielectric constant (high-k) materials,and more particularly to integration of threshold voltage adjustmentlayers into the semiconductor devices.

BACKGROUND OF THE INVENTION

Recent advances in microelectronics have included the use of high-kfilms in gate stacks for logic applications. These high-k films ofteninclude hafnium (Hf) and/or zirconium (Zr) based oxides/silicates thatare deposited on a Si substrate. In addition, advanced gate stacks mayinclude metal gate electrodes that are deposited on the high-k films.The chemical composition of the metal gate electrodes is selected tohave the appropriate work functions for N-MOS and P-MOS transistors.While metal gate electrode layers do not need to be doped to beelectrically conductive, there is not one metal that can set theappropriate work function for both NMOS and PMOS devices; the energyrequired to pull an electron free from the surface of the electrode.

One approach for controlling the gate electrode work function includesdepositing a composite metal-containing gate electrode layer, wherecomposition of the layer can be adjusted to obtain the desiredworkfunction of the gate electrode. However, the effective workfunctionof a gate stack further depends on bulk and surface material properties,crystallographic orientation, and the permittivity of the high-k filminterfacing with the gate electrode layer. In particular, interactionsof the different materials at layer interfaces and diffusion of chemicalspecies throughout a gate stack during post-processing can affect thework function and other properties of the semiconductor device. Thus,methods for controlling the gate electrode work function by controllingcomposition of the gate electrode layer may be ineffective in achievingthe desired work function, and new methods are needed for adjusting andcontrolling the effective work function of semiconductor devicescontaining high-k materials.

SUMMARY OF THE INVENTION

A semiconductor device containing a buried threshold voltage adjustmentlayer and method for forming are disclosed in various embodiments. Theburied threshold voltage adjustment layer may be utilized to control thework function of gate stacks and to obtain the desired thresholdvoltages for N-MOS and P-MOS transistors in a manufactured semiconductordevice.

According to one embodiment of the invention, the method includesproviding a substrate containing an interface layer, depositing a firsthigh-k film on the interface layer, depositing a threshold voltageadjustment layer on the first high-k film, and depositing a secondhigh-k film on the threshold voltage adjustment layer. The thresholdvoltage adjustment layer is interposed between the first and secondhigh-k films.

According to another embodiment of the invention, a semiconductor devicecontaining a patterned gate stack in described. The semiconductordevices contains a substrate having an interface layer thereon, apatterned first high-k film on the interface layer, a patternedthreshold voltage adjustment layer on the first high-k film, a patternedsecond high-k film on the threshold voltage adjustment layer, and apatterned gate electrode on the patterned second high-k film. Thepatterned threshold voltage adjustment layer is interposed between thepatterned first and second high-k films.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIGS. 1A-1G schematically show cross-sectional views of forming asemiconductor device containing a buried threshold voltage adjustmentlayer according to an embodiment of the invention;

FIG. 2 is a process flow diagram for forming a semiconductor devicecontaining a buried threshold voltage adjustment layer according to anembodiment of the invention;

FIG. 3 is a process flow diagram for depositing a high-k materialcontaining a buried threshold voltage adjustment layer according to anembodiment of the invention; and

FIGS. 4A and 4B illustrate processing systems for depositing a high-kmaterial on a substrate according to embodiments of the invention.

DETAILED DESCRIPTION OF SEVERAL EMBODIMENTS

A semiconductor device containing a buried threshold voltage adjustmentlayer and method for forming are disclosed in various embodiments.Recently, gate electrode metals and dielectric threshold voltageadjustment layers have been utilized to control the work function ofgate stacks and to obtain the desired threshold voltages for N-MOS andP-MOS transistors in a manufactured semiconductor device. Exemplarythreshold voltage adjustment layers include lanthanum oxide (La₂O₃) forN-MOS devices and aluminum oxide (Al₂O₃) for P-MOS devices. Thethreshold voltage adjustment layers have generally been positioned abovethe high-k gate dielectric and in contact with the gate electrode. Ithas been shown that during high temperature processing, elements in thethreshold voltage adjustment layers generally diffuse through the high-kgate dielectric towards an interface layer (e.g., a high mobility, lowdefect SiO₂ layer) positioned between the high-k gate dielectric and thesubstrate to cause threshold voltage adjustment near the interface ofthe high-k gate dielectric and the underlying interface layer.

One drawback to positioning the threshold voltage adjustment layer abovethe high-k material and in contact with the gate electrode is that thethreshold voltage adjustment layer needs to be thick enough that is doesnot become depleted by diffusion through the underlying high-k materialduring heat-treating of the semiconductor device. Furthermore, becausethe threshold voltage adjustment layer is a dielectric layer, it cansignificantly add to the equivalent oxide thickness (EOT) of the gatestack. Another drawback is that a high temperature heat-treating isrequired in order for the element(s) of the threshold voltage adjustmentlayer to diffuse through the high-k gate dielectric towards theinterface layer. However, element(s) of some threshold voltageadjustment layers may not sufficiently diffuse through the high-k gatedielectric to fully adjust the threshold voltage of the semiconductordevice to the desired value.

A logical approach to addressing the above problems is to position thethreshold voltage adjust layer at the interface of the high-k gatedielectric and the interface layer. This would allow adjustment andcontrol of the threshold voltage and reduces or eliminates the need forhigh temperature heat-treating, in addition to minimizing the thicknessneeded for the threshold voltage adjustment layer in order to obtain therequired threshold voltage shift. However, the present inventorsdetermined that this approach results in a high defect interface betweenthe threshold voltage adjustment layer and the underlying interfacelayer, leading to low carrier mobility for the semiconductor device.This effect renders the device unusable for practical applications.

Therefore, the present inventors discovered that there is a general needfor new methods and approaches for obtaining the desired thresholdvoltages for semiconductor devices, while minimizing the drawbacks notedabove. Embodiments of the invention provide methods for forming asemiconductor device containing a buried threshold voltage adjustmentlayer and semiconductor devices containing such a layer. According toone embodiment of the invention, the method includes providing asubstrate containing a interface layer, depositing a first high-k filmon the interface layer, depositing a threshold voltage adjustment layeron the first high-k film, and depositing a second high-k film on thethreshold voltage adjustment layer. The method further includesdepositing a gate electrode, performing a gate stack patterning process,and heat-treating the gate stack to adjust and control the thresholdvoltage of the semiconductor device containing the gate stack.

One skilled in the relevant art will recognize that the variousembodiments may be practiced without one or more of the specific detailsdescribed herein, or with other replacement and/or additional methods,materials, or components. In other instances, well-known structures,materials, or operations are not shown or described in detail herein toavoid obscuring aspects of various embodiments of the invention.Similarly, for purposes of explanation, specific numbers, materials, andconfigurations are set forth herein in order to provide a thoroughunderstanding of the invention. Furthermore, it is understood that thevarious embodiments shown in the figures are illustrativerepresentations and are not necessarily drawn to scale.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, material, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the invention, but does not denote thatthey are present in every embodiment. Thus, the appearances of thephrases “in one embodiment” or “in an embodiment” in various placesthroughout this specification are not necessarily referring to the sameembodiment of the invention.

FIGS. 1A-1G schematically show cross-sectional views of forming asemiconductor device containing a buried threshold voltage adjustmentlayer according to an embodiment of the invention. FIG. 1A schematicallyshows a substrate 102 containing an interface layer 104. The substrate102 can be of any size, for example a 200 mm substrate, a 300 mmsubstrate, or an even larger substrate. According to one embodiment, thesubstrate 102 can contain Si, for example crystalline Si,polycrystalline Si, or amorphous Si. In one example, the substrate 102can be a tensile-strained Si layer. According to another embodiment, thesubstrate 102 may contain Ge or Si_(x)Ge_(1-x) compounds, where x is theatomic fraction of Si, 1-x is the atomic fraction of Ge, and 0<1-x<1.Exemplary Si_(x)Ge_(1-x) compounds include Si_(0.1)Ge_(0.9),Si_(0.2)Ge_(0.8), Si_(0.3)Ge_(0.7), Si_(0.4)Ge_(0.6), Si_(0.5)Ge_(0.5),Si_(0.6)Ge_(0.4), Si_(0.7)Ge_(0.3), Si_(0.8)Ge_(0.2), andSi_(0.9)Ge_(0.1). In one example, the substrate 102 can be acompressive-strained Ge layer or a tensile-strained Si_(x)Ge_(1-x)(x>0.5) deposited on a relaxed Si_(0.5)Ge_(0.5) buffer layer. Theinterface layer 104 can, for example, contain high mobility, low defectSiO₂. The interface layer 104 can have a thickness between about 5 andabout 15 angstrom, for example about 8 angstrom.

FIG. 1B schematically shows a first high-k film 106 deposited on theinterface layer 104. The first high-k film 106 can contain hafnium,zirconium, or hafnium and zirconium, including hafnium oxide (HfO₂),hafnium oxynitride (HfON), hafnium silicate (HfSiO), hafnium siliconoxynitride (HfSiON), zirconium oxide (ZrO₂), zirconium oxynitride(ZrON), zirconium silicate (ZrSiO), zirconium silicon oxynitride(ZrSiON), hafnium zirconium oxide (HfZrO₂), hafnium zirconium oxynitride(HfZrON), hafnium zirconium silicate (HfZrSiO), hafnium zirconiumsilicon oxynitride (HfZrSiON), or a combination of two or more thereof.A thickness of the first high-k film 106 can, for example, be at least 2angstrom, between about 2 angstrom and about 30 angstrom, or betweenabout 5 angstrom and about 15 angstrom.

FIG. 1C schematically shows a threshold voltage adjustment layer 108deposited on the first high-k film 106. The threshold voltage adjustmentlayer 108 can contain an oxide, oxynitride, or titanate layer containingone or more elements selected from Group II (beryllium (Be), magnesium(Mg), calcium (Ca), strontium (Sr), and barium (Ba)), Group III(scandium (Sc)), Group XIII (boron (B), aluminum (Al), gallium (Ga),indium (In), and thallium (TI)), rare earth metals of the Periodic Tableof the Elements, or a combination of two or more thereof. Exemplary rareearth elements include yttrium (Y), lutetium (Lu), lanthanum (La),cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium (Sm), europium(Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho),erbium (Er), thulium (Tm), and ytterbium (Yb). Examples of rare earthmetal oxides include lanthanium oxide (La₂O₃) and lutetium oxide(Lu₂O₃). Examples of titanate layers include barium titanate (BaTiO₃),strontium titanate (SrTiO₃), and barium strontium titanate (BaSrTiO₃).According to embodiments of the invention, the threshold voltageadjustment layer 108 can further contain hafnium, zirconium, or hafniumand zirconium. A thickness of the threshold voltage adjustment layer 108can, for example, be between about 2 angstrom and about 30 angstrom, orbetween about 3 angstrom and about 10 angstrom. A lower limit of athickness of the threshold voltage adjustment layer 108 may bedetermined based on a minimum thickness that yields a desired thresholdvoltage.

According to embodiments of the invention, element levels from Group II,Group III, Group XIII, and rare earth metals can be up to 50 atomic % inthe threshold voltage adjustment layer 108. Examples include BaO (50atomic % barium) and La₂O₃ (40 atomic % lanthanum). Undoped HfO₂ has 33atomic hafnium and element levels in a doped hafnium-containingthreshold voltage adjustment layer 108 can, for example, includeapproximately 28 atomic % hafnium and approximately 3 atomic %lanthanum. In general, a doped hafnium-, zirconium-, or hafnium andzirconium-containing threshold voltage adjustment layer 106 can includeany permissible combination of hafnium and/or zirconium with Group II,Group III, Group XIII, and rare earth metals. According to oneembodiment, an element level of an element selected from Group II, GroupIII, Group XIII, and rare earth metals can be less than 20 atomic % inthe threshold voltage adjustment layer 108.

FIG. 1D schematically shows a second high-k film 110 deposited on thethreshold voltage adjustment layer 108. The second high-k film 110 cancontain hafnium, zirconium, hafnium and zirconium, one or more elementsselected from Group II, Group III, Group XIII, rare earth metals of thePeriodic Table of the Elements, titanium dioxide (TiO₂), or acombination of two or more thereof. The second high-k film 110 cancontain HfO₂, HfON, HfSiO, HfSiON, ZrO₂, ZrON, ZrSiO, ZrSiON, HfZrO₂,HfZrON, HfZrSiO, HfZrSiON, or a combination of two or more thereof. Athickness of the second high-k film 110 can, for example, be betweenabout 2 angstrom and about 30 angstrom, or between about 5 angstrom andabout 15 angstrom.

The elements and element levels from Group II, Group III, Group XIII,and rare earth metals in the second high-k film 110 may be differentfrom that of the threshold voltage adjustment layer 108. For example,the element levels may be selected to stabilize a particularcrystallographic form of the material in the second high-k film 110.Furthermore, the elements and element levels selected for thestabilizing may not be preferred for adjusting the threshold voltageusing the threshold voltage adjustment layer 108. In one embodiment,heat treatment can be performed after forming the threshold voltageadjustment layer but before forming the second high-k film. This mayprovide greater diffusion from the threshold voltage adjustment layerinto the first high-k film, and/or may minimize diffusion of elementsfrom the threshold voltage adjustment layer into the second high-k film.

According to embodiments of the invention, each of the first and secondhigh-k films 106,110, and the threshold voltage adjustment layer 108 cancontain hafnium but not zirconium, or alternately, each of the first andsecond high-k films 106,110, and the threshold voltage adjustment layer108 can contain zirconium but not hafnium.

According to embodiments of the invention, a thickness of the first andsecond high-k films 106,110, and a thickness of the threshold voltageadjustment layer 108, may be between about 10 angstrom and about 90angstrom, or between about 12 angstrom and about 50 angstrom. In oneexample, a thickness of the first high-k film 106 can be between about 2angstrom and about 15 angstrom, and a thickness of the second high-kfilm can be about 4 angstrom or greater.

According to one embodiment of the invention, the second high-k film 110can have a higher dielectric constant than the first high-k film 106.For example, the first high-k film 106 may contain hafnium, zirconium,or hafnium and zirconium, and the second high-k film 110 may containdoped hafnium, doped zirconium, or doped hafnium and zirconium. Thesecond high-k film 110 can be doped with one or more elements from GroupII, Group III, Group XIII, rare earth metals from the Periodic Table ofthe Elements, or a combination of two or more thereof. The use of ahigher dielectric constant material in the second high-k film 110provides means for maintaining or increasing the physical thickness ofthe high-k gate stack containing first and second high-k films 106,110and threshold voltage adjustment layer 108, while scaling the EOT belowa level attained by un-doped high-k materials (e.g., HfO₂ or ZrO₂).

FIG. 1E schematically shows a gate electrode 112 deposited on the secondhigh-k film 110. The gate electrode 112 can, for example, have athickness between about 5 nm and about 40 nm, or between about 5 nm andabout 10 nm and can, for example, contain W, WN, WSi_(x), Al, Mo, Ta,TaN, TaSiN, HfN, HfSiN, Ti, TiN, TiSiN, Mo, MoN, Re, Pt, or Ru. The gateelectrode may further be capped with a polysilicon layer, an oxygendiffusion barrier or both. Representative oxygen diffusion barriersinclude, but are not limited to amorphous silicon, TiN, TaN, TaSiN,TiSiN and Ru.

According to an embodiment of the invention, the film structure shown inFIG. 1E is further processed to form a patterned gate stack usingstandard lithography and etching methods. For example, aphotolithography tool may be used to image a pattern onto a photoresistmaterial deposited on the film structure in FIG. 1E. The patternprovides a physical barrier during a subsequent etching process (e.g., aplasma etching process) that selectively removes material not protectedby the exposed photoresist. FIG. 1F schematically shows a patterned gatestack containing a patterned interface layer 114, patterned first high-kfilm 116, a patterned threshold voltage adjustment layer 118, apatterned second high-k film 120, and a patterned gate electrode 122.

Following formation of the patterned gate stack depicted in FIG. 1F, thepatterned gate stack may be heat-treated to control and adjust the workfunction of the semiconductor device. As schematically depicted in FIG.1G, the heat-treating diffuses element(s) 108 a from patterned thresholdvoltage adjustment layer 118 into the patterned first high-k film 116towards the patterned interface layer 114 and the substrate 102, andinto the patterned second high-k film 120 towards the patterned gateelectrode 122. As those skilled in the art will readily realize, thediffusion may be initiated during deposition of the second high-k film110 onto the threshold voltage adjustment layer 108 or during subsequentprocessing steps prior to the heat-treating step.

According to embodiments of the invention, positioning of the patternedthreshold voltage adjustment layer 118 between the patterned first andsecond high-k films 116, 120, allows for lower heat-treatingtemperatures and shorter processing times compared to approaches wherethe patterned threshold voltage adjustment layer 118 is positioned abovethe patterned second high-film 120 and in contact with the patternedgate electrode 122. This is because the diffusing element(s) 108 a arenot required to diffuse through a full thickness of the high-k gatestack, for example. Furthermore, positioning the patterned thresholdvoltage adjustment layer 118 between the patterned first and secondhigh-k films 116, 120, and thus closer to the interface layer 104, mayenable the use of a patterned threshold voltage adjustment layer 118containing element(s) 108 a with low rates of diffusion in otherdielectric materials (i.e., the patterned first and second high-k films116, 120). This approach of positioning the patterned threshold voltageadjustment layer closer to the interface layer 104 can result in alarger workfunction shift, and may be particularly useful in integrationschemes including a replacement gate for which thermal budgetconsiderations are crucial, and good conformality is required.Furthermore, according to embodiment of the invention, a thickness ofthe threshold voltage adjustment layer 108 may be minimized withoutaffecting the properties of the interface layer 104. Still further, byspacing the patterned threshold voltage adjustment layer 118 from theinterface layer 104, the above advantages can be obtained whileretaining the high mobility, low defect properties of the interfacelayer 104. Further, although the semiconductor processing industrygenerally avoids additional processing steps in the formation of a gatestack, the present inventors realized that forming the threshold voltageadjustment layer interposed between the high-k films provides advantagesthat warrant the additional processing step necessary to achieve thisconfiguration.

According to embodiments of the invention, one or more of the firsthigh-k film 106, the second high-k film 110, and the threshold voltageadjustment layer 108 may be deposited by atomic layer deposition (ALD),plasma-enhanced ALD (PEALD), chemical vapor deposition (CVD), orplasma-enhanced CVD (PECVD). According to one embodiment of theinvention, ALD or PEALD may be utilized due to normally superioruniformity and atomic level thickness control compared to CVD and PECVDmethods.

FIG. 2 is a process flow diagram for forming a semiconductor devicecontaining a buried threshold voltage adjustment layer according to anembodiment of the invention. The processing system 1 of FIG. 4A or theplasma processing system 100 of FIG. 4B may be utilized for depositing afirst high-k film, a threshold voltage adjustment layer, and a secondhigh-k film. Alternately, any other processing systems suitable forperform a thin film deposition process may be used.

Referring now to FIGS. 1A-1G, FIG. 2, and FIG. 4A, the process 200begins in step 202 when substrate 102 is provided in a process chamber10 of processing system 1. The substrate 102 contains an interface layer104. Alternately, the interface layer 104 may be formed on the substrate102 in the process chamber 10. In step 204, a first high-k film 106 isdeposited on the interface layer 104, and in step 206, a thresholdvoltage adjustment layer 108 is deposited on the first high-k film 106.Thereafter, in step 208, a second high-k film 110 is deposited on thethreshold voltage adjustment layer 108. In step 210, a gate electrode112 is deposited on the second high-k film 110. In step 212, a gatestack patterning process is performed to form a patterned gate stackdepicted in FIG. 1F. In step 214, the patterned gate stack isheat-treated to diffuse element(s) 108 a from the patterned thresholdvoltage adjustment layer 118 into the patterned first and second high-kfilms 116, 120. Exemplary heat-treating conditions include temperaturebetween approximately 500° C. and approximately 1100° C. and processingtimes greater than approximately 15 seconds. The heat-treating allowsfor adjusting and controlling the work function of a semiconductordevice containing the patterned gate stack. In an alternativeembodiment, heat treatment may be performed prior to the patterningprocess to realize the benefits and advantages described herein.

According to another embodiment of the invention, the film structureschematically shown in FIG. 1C may be heat-treated prior to depositingsecond high-k film 110 on the threshold voltage adjustment layer 108.The heat-treating results in diffusion of elements from the thresholdvoltage adjustment layer 108 into the first high-k film 106 towards theinterface layer 104 and the substrate 102. Since heat-treating isperformed before deposition of the second high-k film 110 on thethreshold voltage adjustment layer 108, any subsequent heat-treating ofthe film structures schematically shown in FIG. 1D-1E is expected toresult in reduced diffusion of the elements from the threshold voltageadjustment layer 108 into the second high-k film 110 or from thepatterned threshold voltage adjustment layer 118 into the patternedsecond high-k film 120 in FIG. 1F.

According to yet another embodiment of the invention, the film structureschematically shown FIG. 1D may be heat-treated prior to depositing thegate electrode 112 on the second high-k film 110. According to stillanother embodiment of the invention, the film structure schematicallyshown FIG. 1E may be heat-treated prior to performing the patterningprocess depicted in FIG. 1F.

In summary, heat-treating may be performed following deposition of thethreshold voltage adjustment layer 108 (FIG. 1C), following depositionof the second high-k film 110 (FIG. 1D), following deposition of thegate electrode 112 (FIG. 1E), or following formation of the patternedgate stack (FIG. 1F), or a combination of two or more thereof.

According to one embodiment of the invention, a first high-k film 106,second high-k film 110, and threshold voltage adjustment layer 108 maybe deposited in the processing system 1 using ALD. An exemplary ALDprocess for depositing oxide materials is described in FIG. 3. In step302, a substrate 102 containing an interface layer 104 is provided instep 302. In step 304, the substrate 102 is exposed to a gas pulsecontaining a first metal precursor to adsorb a layer less than amonolayer thick of the first metal precursor on the interface layer 104.The chemisorbed layer can be less than a monolayer thick due to thenormally large size of the metal precursor compared to the size of themetal element. In step 306, the substrate 102 is exposed to a gas pulsecontaining an oxidation source that reacts with the adsorbed first metalprecursor. The oxidation source can include atomic oxygen (O), O₂,ozone, H₂O, H₂O₂, or a combination thereof, and optionally an inert gassuch as Ar. By repeating this sequential gas exposure in steps 304 and306, as shown by process flow arrow 316, it is possible to achieve layerby layer growth of about 1 angstrom per cycle. Steps 304 and 306 may berepeated any number of times to deposit a first high-k film 106 with adesired thickness on the interface layer 104.

In step 308, the substrate 102 is exposed to a gas containing a secondmetal precursor to adsorb a layer of the second metal precursor on thesubstrate 102 and, in step 310, the substrate 102 is exposed to a gaspulse containing an oxidation source that reacts with the adsorbedsecond metal precursor. As shown by process flow arrow 318, steps 308and 310 may be repeated any number of times to deposit a thresholdvoltage adjustment layer 108 with a desired thickness on the firsthigh-k film 106.

In step 312, the substrate 102 is exposed to a gas pulse containing athird metal precursor to adsorb a layer of the third metal precursor onthe substrate 102 and, in step 314, the substrate 102 is exposed to agas pulse containing an oxidation source that reacts with the adsorbedthird metal precursor. As shown by process flow arrow 320, steps 312 and314 may be repeated any number of times to deposit a second high-k filmwith a desired thickness on the threshold voltage adjustment layer 108.Once the second high-k film is formed, the gate stack may be formed by apatterning process, and the gate stack exposed to heat treatment asdescribed above. Although not shown in FIG. 3, the process chamber maybe purged or evacuated to remove any unreacted metal precursor,byproducts, and oxidation source gas from the process chamber betweenthe sequential and alternating gas pulses.

FIG. 4A illustrates a processing system 1 for depositing first high-kfilm 106, a second high-k film 110, and threshold voltage adjustmentlayer 108 on a substrate 102 according to one embodiment of theinvention. The processing system 1 may be configured for performing ALDor CVD processing. The processing system 1 includes a process chamber 10having a substrate holder 20 configured to support a substrate 102, uponwhich the high-k material is formed. The process chamber 10 furthercontains an upper assembly 30 (e.g., a showerhead) coupled to a firstprecursor supply system 40 (e.g., hafnium precursor supply system), asecond precursor supply system 42 (e.g., zirconium precursor supplysystem), a purge gas supply system 44, an oxygen-containing gas supplysystem 46, a nitrogen-containing gas supply system 48, and an auxiliarygas supply system 50 for supplying one or more elements selected fromGroup II, Group III, Group XIII, rare earth elements of the PeriodicTable of the Elements, or other elements, for example silicon. Inaddition, the oxygen-containing gas supply system 46 or thenitrogen-containing gas supply system 48 may be configured to supply anoxygen- and nitrogen-containing gas. Additionally, processing system 1includes a substrate temperature control system 60 coupled to substrateholder 20 and configured to elevate and control the temperature ofsubstrate 102. Furthermore, the processing system 1 includes acontroller 70 that can be coupled to process chamber 10, substrateholder 20, upper assembly 30 configured for introducing process gasesinto the process chamber 10, first precursor supply system 40, secondprecursor supply system 42, purge gas supply system 44,oxygen-containing gas supply system 46, nitrogen-containing gas supplysystem 48, auxiliary gas supply system 50, and substrate temperaturecontrol system 60.

Alternatively, or in addition, controller 70 can be coupled to one ormore additional controllers/computers (not shown), and controller 70 canobtain setup and/or configuration information from an additionalcontroller/computer.

In FIG. 4A, singular processing elements (10, 20, 30, 40, 42, 44, 46,48, 50, and 60) are shown, but this is not required for the invention.The processing system 1 can include any number of processing elementshaving any number of controllers associated with them in addition toindependent processing elements. The controller 70 can be used toconfigure any number of processing elements (10, 20, 30, 40, 42, 44, 46,48, 50, and 60), and the controller 70 can collect, provide, process,store, and display data from processing elements. The controller 70 cancomprise a number of applications for controlling one or more of theprocessing elements. For example, controller 70 can include a graphicuser interface (GUI) component (not shown) that can provide easy to useinterfaces that enable a user to monitor and/or control one or moreprocessing elements.

Still referring to FIG. 4A, the processing system 1 may be configured toprocess 200 mm substrates, 300 mm substrates, or larger-sizedsubstrates. In fact, it is contemplated that the processing system 1 maybe configured to process substrates, wafers, or LCDs regardless of theirsize, as would be appreciated by those skilled in the art. Therefore,while aspects of the invention will be described in connection with theprocessing of a semiconductor substrate, the invention is not limitedsolely thereto. Alternately, a batch processing system capable ofprocessing multiple substrates simultaneously may be utilized fordepositing the high-k materials described in the embodiments of theinvention.

The first precursor supply system 40 and the second precursor supplysystem 42 may be configured to alternately or simultaneously introduce ahafnium precursor and a zirconium precursor to process chamber 10. Thealternation of the introduction of the hafnium precursor and thezirconium precursor can be cyclical, or it may be acyclical withvariable time periods between introduction of the hafnium and zirconiumprecursors.

According to embodiments of the invention, several methods may beutilized for introducing the first and/or second precursors to theprocess chamber 10. One method includes vaporizing precursors throughthe use of separate bubblers or direct liquid injection (DLI) systems,or a combination thereof, and then mixing in the gas phase within orprior to introduction into the process chamber 10. DLI systems have beenshown to reduce premature thermal decomposition of precursors overbubbling methods. By controlling the vaporization rate of each precursorseparately, a desired stoichiometry can be attained within the depositedfilm. Another method of delivering the first and second precursorsincludes separately controlling two or more different liquid sources(neat precursors or precursor solutions), which are then mixed prior toentering a common vaporizer. This method may be utilized when theprecursors are compatible in solution or in liquid form and they havesimilar vaporization characteristics. Yet another method of deliveringthe first and second precursor includes controlling the flow of a liquidprecursor mixture (neat precursors or precursors solutions) to a commonvaporizer. Other methods include the use of compatible mixed solid orliquid precursors within a bubbler. Liquid source precursors may includeneat liquid precursors, or solid or liquid precursors that are dissolvedin a compatible solvent. Possible compatible solvents include, but arenot limited to, ionic liquids, hydrocarbons (aliphatic, olefins, andaromatic), amines, esters, glymes, crown ethers, ethers and polyethers.In some cases it may be possible to dissolve one or more compatiblesolid precursors in one or more compatible liquid precursors. It will beapparent to one skilled in the art that by controlling the relativeconcentration levels of the first and second precursors within a gaspulse, it is possible to deposit films with desired stoichiometries. Inone example, hafnium zirconium based films can contain between 5 and 95atomic percent zirconium (5%<% Zr/(% Zr+% Hf)<95%), and between 5 and 95atomic percent hafnium (5%<% Hf/(% Zr+% Hf)<95%).

Embodiments of the invention may utilize a wide variety of hafnium andzirconium precursors. For example, representative examples include:Hf(O^(t)Bu)₄ (hafnium tert-butoxide, HTB), Hf(NEt₂)₄(tetrakis(diethylamido)hafnium, TDEAH), Hf(NEtMe)₄(tetrakis(ethylmethylamido)hafnium, TEMAH), Hf(NMe₂)₄(tetrakis(dimethylamido)hafnium, TDMAH), Zr(O^(t)Bu)₄ (zirconiumtert-butoxide, ZTB), Zr(NEt₂)₄ (tetrakis(diethylamido)zirconium, TDEAZ),Zr(NMeEt)₄ (tetrakis(ethylmethylamido)zirconium, TEMAZ), Zr(NMe₂)₄(tetrakis(dimethylamido)zirconium, TDMAZ), Hf(mmp)₄, Zr(mmp)₄, HfCl₄,ZrCl₄, ZrCp₂Me₂, Zr(tBuCp)₂Me₂, and Zr(NiPr₂)₄. In one example, thehafnium and zirconium precursors may have the same ligands (e.g., HTBand ZTB), thereby preventing any possible detrimental ligand exchangebetween the precursors.

Embodiments of the invention may utilize one or more of a wide varietyof different elements selected from Group II, Group III, Group XIII, andrare earth metals of the Periodic Table. The elements may be providedusing any precursor gases that have sufficient reactivity, thermalstability, and volatility. The precursor gases may be delivered to theprocess chamber using bubbling or DLI methods described above forhafnium and zirconium precursors.

Embodiments of the inventions may utilize a wide variety of differentrare earth precursors. For example, many rare earth precursors have theformula:ML¹L²L³D_(x)where M is a rare earth metal element selected from the group of yttrium(Y), lutetium (Lu), lanthanum (La), cerium (Ce), praseodymium (Pr),neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium(Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm), andytterbium (Yb). L¹, L², L³ are individual anionic ligands, and D is aneutral donor ligand where x can be 0, 1, 2, or 3. Each L¹, L², L³ligand may be individually selected from the groups of alkoxides,halides, aryloxides, amides, cyclopentadienyls, alkyls, silyls,amidinates, β-diketonates, ketoiminates, silanoates, and carboxylates. Dligands may be selected from groups of ethers, furans, pyridines,pyroles, pyrolidines, amines, crown ethers, glymes, and nitriles.

Examples of L group alkoxides include tert-butoxide, iso-propoxide,ethoxide, 1-methoxy-2,2-dimethyl-2-propionate (mmp),1-dimethylamino-2,2′-dimethyl-propionate, amyloxide, and neo-pentoxide.Examples of halides include fluoride, chloride, iodide, and bromide.Examples of aryloxides include phenoxide and 2,4,6-trimethylphenoxide.Examples of amides include bis(trimethylsilyl)amide di-tert-butylamide,and 2,2,6,6-tetramethylpiperidide (TMPD). Examples of cyclopentadienylsinclude cyclopentadienyl, 1-methylcyclopentadienyl,1,2,3,4-tetramethylcyclopentadienyl, 1-ethylcyclopentadienyl,pentamethylcyclopentadienyl, 1-iso-propylcyclopentadienyl,1-n-propylcyclopentadienyl, and 1-n-butylcyclopentadienyl. Examples ofalkyls include bis(trimethylsilyl)methyl, tris(trimethylsilyl)methyl,and trimethylsilylmethyl. An example of a silyl is trimethylsilyl.Examples of amidinates include N,N′-di-tert-butylacetamidinate,N,N′-di-iso-propylacetamidinate,N,N′-di-isopropyl-2-tert-butylamidinate, andN,N′-di-tert-butyl-2-tert-butylamidinate. Examples of β-diketonatesinclude 2,2,6,6-tetramethyl-3,5-heptanedionate (THD),hexafluoro-2,4-pentandionate, and6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionate (FOD). Anexample of a ketoiminate is 2-iso-propylimino-4-pentanonate. Examples ofsilanoates include tri-tert-butylsiloxide and triethylsiloxide. Anexample of a carboxylate is 2-ethylhexanoate.

Examples of D ligands include tetrahydrofuran, diethylether,1,2-dimethoxyethane, diglyme, triglyme, tetraglyme, 12-Crown-6,10-Crown-4, pyridine, N-methylpyrolidine, triethylamine, trimethylamine,acetonitrile, and 2,2-dimethylpropionitrile.

Representative examples of rare earth precursors include:

Y precursors: Y(N(SiMe₃)₂)₃, Y(N(iPr)₂)₃, Y(N(tBu)SiMe₃)₃, Y(TMPD)₃,Cp₃Y, (MeCp)₃Y, ((nPr)Cp)₃Y, ((nBu)Cp)₃Y, Y(OCMe₂CH₂NMe₂)₃, Y(THD)₃,Y[OOCCH(C₂H₅)C₄H₉]₃, Y(C₁₁H₁₉O₂)₃CH₃(OCH₂CH₂)₃OCH₃, Y(CF₃COCHCOCF₃)₃,Y(OOCC₁₀H₇)₃, Y(OOC₁₀H₁₉)₃, and Y(O(iPr))₃.

La precursors: La(N(SiMe₃)₂)₃, La(N(iPr)₂)₃, La(N(tBu)SiMe₃)₃,La(TMPD)₃, ((iPr)Cp)₃La, Cp₃La, Cp₃La(NCCH₃)₂, La(Me₂NC₂H₄Cp)₃,La(THD)₃, La[OOCCH(C₂H₅)C₄H₉]₃, La(C₁₁H₁₉O₂)₃.CH₃(OCH₂CH₂)₃OCH₃,La(C₁₁H₁₉O₂)₃.CH₃(OCH₂CH₂)₄OCH₃, La(O(iPr))₃, La(OEt)₃, La(acac)₃,La(((tBu)₂N)₂CMe)₃, La(((iPr)₂N)₂CMe)₃, La(((tBu)₂N)₂C(tBu))₃,La(((iPr)₂N)₂C(tBu))₃, and La(FOD)₃.

Ce precursors: Ce(N(SiMe₃)₂)₃, Ce(N(iPr)₂)₃, Ce(N(tBu)SiMe₃)₃,Ce(TMPD)₃, Ce(FOD)₃, ((iPr)Cp)₃Ce, Cp₃Ce, Ce(Me₄Cp)₃, Ce(OCMe₂CH₂NMe₂)₃,Ce(THD)₃, Ce[OOCCH(C₂H₅)C₄H₉]₃, Ce(C₁₁H₁₉O₂)₃.CH₃(OCH₂CH₂)₃OCH₃,Ce(C₁₁H₁₉O₂)₃.CH₃(OCH₂CH₂)₄OCH₃, Ce(O(iPr))₃, and Ce(acac)₃.

Pr precursors: Pr(N(SiMe₃)₂)₃, ((iPr)Cp)₃Pr, Cp₃Pr, Pr(THD)₃, Pr(FOD)₃,(C₅Me₄H)₃Pr, Pr[OOCCH(C₂H₅)C₄H₉]₃, Pr(C₁₁H₁₉O₂)₃.CH₃(OCH₂CH₂)₃OCH₃,Pr(O(iPr))₃, Pr(acac)₃, Pr(hfac)₃, Pr(((tBu)₂N)₂CMe)₃,Pr(((iPr)₂N)₂CMe)₃, Pr(((tBu)₂N)₂C(tBu))₃, and Pr(((iPr)₂N)₂C(tBu))₃.

Nd precursors: Nd(N(SiMe₃)₂)₃, Nd(N(iPr)₂)₃, ((iPr)Cp)₃Nd, Cp₃Nd,(C₅Me₄H)₃Nd, Nd(THD)₃, Nd[OOCCH(C₂H₅)C₄H₉]₃, Nd(O(iPr))₃, Nd(acac)₃,Nd(hfac)₃, Nd(F₃CC(O)CHC(O)CH₃)₃, and Nd(FOD)₃.

Sm precursors: Sm(N(SiMe₃)₂)₃, ((iPr)Cp)₃Sm, Cp₃Sm, Sm(THD)₃,Sm[OOCCH(C₂H₅)C₄H₉]₃, Sm(O(iPr))₃, Sm(acac)₃, and (C₅Me₅)₂Sm.

Eu precursors: Eu(N(SiMe₃)₂)₃, ((iPr)Cp)₃Eu, Cp₃Eu, (Me₄Cp)₃Eu,Eu(THD)₃, Eu[OOCCH(C₂H₅)C₄H₉]₃, Eu(O(iPr))₃, Eu(acac)₃, and (C₅Me₅)₂Eu.

Gd precursors: Gd(N(SiMe₃)₂)₃, ((iPr)Cp)₃Gd, Cp₃Gd, Gd(THD)₃,Gd[OOCCH(C₂H₅)C₄H₉]₃, Gd(O(iPr))₃, and Gd(acac)₃.

Tb precursors: Tb(N(SiMe₃)₂)₃, ((iPr)Cp)₃Tb, Cp₃Tb, Tb(THD)₃,Tb[OOCCH(C₂H₅)C₄H₉]₃, Tb(O(iPr))₃, and Tb(acac)₃.

Dy precursors: Dy(N(SiMe₃)₂)₃, ((iPr)Cp)₃Dy, Cp₃Dy, Dy(THD)₃,Dy[OOCCH(C₂H₅)C₄H₉]₃, Dy(O(iPr))₃, Dy(O₂C(CH₂)₆CH₃)₃, and Dy(acac)₃.

Ho precursors: Ho(N(SiMe₃)O₃, ((iPr)Cp)₃Ho, Cp₃Ho, Ho(THD)₃,Ho[OOCCH(C₂H₅)C₄H₉]₃, Ho(O(iPr))₃, and Ho(acac)₃.

Er precursors: Er(N(SiMe₃)₂)₃, ((iPr)Cp)₃Er, ((nBu)Cp)₃Er, Cp₃Er,Er(THD)₃, Er[OOCCH(C₂H₅)C₄H₉]₃, Er(O(iPr))₃, and Er(acac)₃.

Tm precursors: Tm(N(SiMe₃)₂)₃, ((iPr)Cp)₃Tm, Cp₃Tm, Tm(THD)₃,Tm[OOCCH(C₂H₅)C₄H₉]₃, Tm(O(iPr))₃, and Tm(acac)₃.

Yb precursors: Yb(N(SiMe₃)₂)₃, Yb(N(iPr)₂)₃, ((iPr)Cp)₃Yb, Cp₃Yb,Yb(THD)₃, Yb[OOCCH(C₂H₅)C₄H₉]₃, Yb(O(iPr))₃, Yb(acac)₃, (C₅Me₅)₂Yb,Yb(hfac)₃, and Yb(FOD)₃.

Lu precursors: Lu(N(SiMe₃)₂)₃, ((iPr)Cp)₃Lu, Cp₃Lu, Lu(THD)₃,Lu[OOCCH(C₂H₅)C₄H₉]₃, Lu(O(iPr))₃, and Lu(acac)₃.

In the above precursors, as well as precursors set forth below, thefollowing common abbreviations are used: Si: silicon; Me: methyl; Et:ethyl; iPr: isopropyl; nPr: n-propyl; Bu: butyl; nBu: n-butyl; sBu:sec-butyl; iBu: iso-butyl; tBu: tert-butyl; Cp: cyclopentadienyl; THD:2,2,6,6-tetramethyl-3,5-heptanedionate; TMPD:2,2,6,6-tetramethylpiperidide; acac: acetylacetonate; hfac:hexafluoroacetylacetonate; and FOD:6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionate.

Still referring to FIG. 4A, the oxygen-containing gas supply system 46is configured to introduce an oxygen-containing gas to the processchamber 10. The oxygen-containing gas can include, but is not limitedto, O₂, water (H₂O), or peroxide (H₂O₂), or a combination thereof, andoptionally an inert gas such as Ar. Similarly, the nitrogen-containinggas supply system 48 is configured to introduce a nitrogen-containinggas to the process chamber 10. Examples of nitrogen-containing gasesinclude, but are not limited to, ammonia (NH₃), hydrazine (N₂H₄), andC₁-C₁₀ alkylhydrazine compounds. Common C₁ and C₂ alkylhydrazinecompounds include monomethyl-hydrazine (MeNHNH₂), 1,1-dimethyl-hydrazine(Me₂NNH₂), and 1,2-dimethyl-hydrazine (MeNHNHMe). According to oneembodiment of the invention, an oxygen- and nitrogen-containing gas maybe utilized, for example, NO, NO₂, or N₂O, or a combination thereof, andoptionally an inert gas such as Ar.

Embodiments of the inventions may utilize a wide variety of differentGroup II (alkaline earth) precursors. For example, many Group IIprecursors have the formula:ML¹L²D_(x)where M is an alkaline earth metal element selected from the group ofberyllium (Be), magnesium (Mg), calcium (Ca), strontium (Sr), and barium(Ba). L¹ and L² are individual anionic ligands, and D is a neutral donorligand where x can be 0, 1, 2, or 3. Each L¹, L² ligand may beindividually selected from the groups of alkoxides, halides, aryloxides,amides, cyclopentadienyls, alkyls, silyls, amidinates, β-diketonates,ketoiminates, silanoates, and carboxylates. D ligands may be selectedfrom groups of ethers, furans, pyridines, pyroles, pyrolidines, amines,crown ethers, glymes, and nitriles.

Examples of L group alkoxides include tert-butoxide, iso-propoxide,ethoxide, 1-methoxy-2,2-dimethyl-2-propionate (mmp),1-dimethylamino-2,2′-dimethyl-propionate, amyloxide, and neo-pentoxide.Examples of halides include fluoride, chloride, iodide, and bromide.Examples of aryloxides include phenoxide and 2,4,6-trimethylphenoxide.Examples of amides include bis(trimethylsilyl)amide di-tert-butylamide,and 2,2,6,6-tetramethylpiperidide (TMPD). Examples of cyclepentadienylsinclude cyclopentadienyl, 1-methylcyclopentadienyl,1,2,3,4-tetramethylcyclopentadienyl, 1-ethylcyclopentadienyl,pentamethylcyclopentadienyl, 1-iso-propylcyclopentadienyl,1-n-propylcyclopentadienyl, and 1-n-butylcyclopentadienyl. Examples ofalkyls include bis(trimethylsilyl)methyl, tris(trimethylsilyl)methyl,and trimethylsilylmethyl. An example of a silyl is trimethylsilyl.Examples of amidinates include N,N′-di-tert-butylacetamidinate,N,N′-di-iso-propylacetamidinate,N,N′-di-isopropyl-2-tert-butylamidinate, andN,N′-di-tert-butyl-2-tert-butylamidinate. Examples of β-diketonatesinclude 2,2,6,6-tetramethyl-3,5-heptanedionate (THD),hexafluoro-2,4-pentanedionate (hfac), and6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionate (FOD). Anexample of a ketoiminate is 2-iso-propylimino-4-pentanonate. Examples ofsilanoates include tri-tert-butylsiloxide and triethylsiloxide. Anexample of a carboxylate is 2-ethylhexanoate.

Examples of D ligands include tetrahydrofuran, diethylether,1,2-dimethoxyethane, diglyme, triglyme, tetraglyme, 12-Crown-6,10-Crown-4, pyridine, N-methylpyrolidine, triethylamine, trimethylamine,acetonitrile, and 2,2-dimethylpropionitrile.

Representative examples of Group II (alkaline earth) precursors include:

Be precursors: Be(N(SiMe₃)₂)₂, Be(TMPD)₂, and BeEt₂.

Mg precursors: Mg(N(SiMe₃)₂)₂, Mg(TMPD)₂, Mg(PrCp)₂, Mg(EtCp)₂, andMgCp₂.

Ca precursors: Ca(N(SiMe₃)₂)₂, Ca(iPr₄Cp)₂, and Ca(Me₅Cp)₂.

Sr precursors: Bis(tert-butylacetamidinato)strontium (TBAASr),Sr(N(SiMe₃)₂)₂, Sr(THD)₂, Sr(THD)₂(tetraglyme), Sr(iPr₄Cp)₂,Sr(iPr₃Cp)₂, and Sr(Me₅Cp)₂.

Ba precursors: Bis(tert-butylacetamidinato)barium (TBAABa),Ba(N(SiMe₃)₂)₂, Ba(THD)₂, Ba(THD)₂(tetraglyme), Ba(iPr₄Cp)₂, Ba(Me₅Cp)₂,and Ba(nPrMe₄Cp)₂.

Embodiments of the inventions may utilize a wide variety of differentprecursors for Group XIII high-k forming elements (B, Al, Ga, In, Tl)into the hafnium zirconium based films. For example, many Al precursorshave the formula:AlL¹L²L³D_(x)where L¹, L², L³ are individual anionic ligands, and D is a neutraldonor ligand where x can be 0, 1, or 2. Each L¹, L², L³ ligand may beindividually selected from the groups of alkoxides, halides, aryloxides,amides, cyclopentadienyls, alkyls, silyls, amidinates, β-diketonates,ketoiminates, silanoates, and carboxylates. D ligands may be selectedfrom groups of ethers, furans, pyridines, pyroles, pyrolidines, amines,crown ethers, glymes, and nitriles.

Other examples of Al precursors include: Al₂Me₆, Al₂Et₆, [Al(O(sBu))₃]₄,Al(CH₃COCHCOCH₃)₃, AlBr₃, AlI₃, Al(O(iPr))₃, [Al(NMe₂)₃]₂, Al(iBu)₂Cl,Al(iBu)₃, Al(iBu)₂H, AlEt₂Cl, Et₃Al₂(O(sBu))₃, and Al(THD)₃.

Examples of Ga precursors include GaCl₃ and GaH₃, examples of Inprecursors include InCl₃ and InH₃, and examples of B precursors includeborane (BH₃), diborane (B₂H₆), tri-ethylboron (BEt₃), triphenylboron(BPh₃), and borane adducts such as Me₃N:BH₃, and BCl₃.

Embodiments of the invention may utilize a wide variety of siliconprecursors for incorporating silicon into the hafnium zirconium basedfilms. Examples of silicon precursors include, but are not limited to,silane (SiH₄), disilane (Si₂H₆), monochlorosilane (SiClH₃),dichlorosilane (SiH₂Cl₂), trichlorosilane (SiHCl₃), hexachlorodisilane(Si₂Cl₆), diethylsilane (Et₂SiH₂), and alkylaminosilane compounds.Examples of alkylaminosilane compounds include, but are not limited to,di-isopropylaminosilane (H₃Si(NPr₂)), bis(tert-butylamino)silane((C₄H₉(H)N)₂SiH₂), tetrakis(dimethylamino)silane (Si(NMe₂)₄),tetrakis(ethylmethylamino)silane (Si(NEtMe)₄),tetrakis(diethylamino)silane (Si(NEt₂)₄), tris(dimethylamino)silane(HSi(NMe₂)₃), tris(ethylmethylamino)silane (HSi(NEtMe)₃),tris(diethylamino)silane (HSKNEt₂)₃), and tris(dimethylhydrazino)silane(HSi(N(H)NMe₂)₃), bis(diethylamino)silane (H₂Si(NEt₂)₂),bis(di-isopropylamino)silane (H₂Si(NPr₂)₂), tris(isopropylamino)silane(HSi(NPr₂)₃), and (di-isopropylamino)silane (H₃Si(NPr₂).

Still referring to FIG. 4A, the purge gas supply system 44 is configuredto introduce a purge gas to process chamber 10. For example, theintroduction of purge gas may occur between introduction of pulses offirst and second precursors and an oxygen-containing gas, anitrogen-containing gas, an oxygen- and a nitrogen-containing gas, or ahigh-k forming gas to the process chamber 10. The purge gas can containan inert gas, such as a noble gas (i.e., He, Ne, Ar, Kr, Xe), nitrogen(N₂), or hydrogen (H₂).

Furthermore, processing system 1 includes substrate temperature controlsystem 60 coupled to the substrate holder 20 and configured to elevateand control the temperature of substrate 102. Substrate temperaturecontrol system 60 contains temperature control elements, such as acooling system including a re-circulating coolant flow that receivesheat from substrate holder 20 and transfers heat to a heat exchangersystem (not shown), or when heating, transfers heat from the heatexchanger system. Additionally, the temperature control elements caninclude heating/cooling elements, such as resistive heating elements, orthermo-electric heaters/coolers, which can be included in the substrateholder 20, as well as the chamber wall of the process chamber 10 and anyother component within the processing system 1. The substratetemperature control system 60 can, for example, be configured to elevateand control the substrate temperature from room temperature toapproximately 350° C. to 550° C. Alternatively, the substratetemperature can, for example, range from approximately 150° C. to 350°C. It is to be understood, however, that the temperature of thesubstrate is selected based on the desired temperature for causingdeposition of a particular dielectric material on the surface of a givensubstrate.

In order to improve the thermal transfer between substrate 102 andsubstrate holder 20, substrate holder 20 can include a mechanicalclamping system, or an electrical clamping system, such as anelectrostatic clamping system, to affix substrate 102 to an uppersurface of substrate holder 20. Furthermore, substrate holder 20 canfurther include a substrate backside gas delivery system configured tointroduce gas to the back-side of substrate 102 in order to improve thegas-gap thermal conductance between substrate 102 and substrate holder20. Such a system can be utilized when temperature control of thesubstrate is required at elevated or reduced temperatures. For example,the substrate backside gas system can contain a two-zone gasdistribution system, wherein the helium gas gap pressure can beindependently varied between the center and the edge of substrate 102.

Furthermore, the process chamber 10 is further coupled to a pressurecontrol system 32, including a vacuum pumping system 34 and a valve 36,through a duct 38, wherein the pressure control system 32 is configuredto controllably evacuate the process chamber 10 to a pressure suitablefor forming the thin film on substrate 102, and suitable for use of thefirst and second process materials. The vacuum pumping system 34 caninclude a turbo-molecular vacuum pump (TMP) or a cryogenic pump capableof a pumping speed up to about 5000 liters per second (and greater) andvalve 36 can include a gate valve for throttling the chamber pressure.Moreover, a device for monitoring chamber pressure (not shown) can becoupled to the process chamber 10. The pressure control system 32 can,for example, be configured to control the process chamber pressurebetween about 0.1 Torr and about 100 Torr during deposition of thehigh-k materials.

The first precursor supply system 40, second precursor supply system 42,purge gas supply system 44, oxygen-containing gas supply system 46, thenitrogen-containing gas supply system 48, and auxiliary gas supplysystem 50 can include one or more pressure control devices, one or moreflow control devices, one or more filters, one or more valves, and/orone or more flow sensors. The flow control devices can include pneumaticdriven valves, electro-mechanical (solenoidal) valves, and/or high-ratepulsed gas injection valves. According to embodiments of the invention,gases may be sequentially and alternately pulsed into the processchamber 10, where the length of each gas pulse can, for example, bebetween about 0.1 sec and about 100 sec. Alternately, the length of eachgas pulse can be between about 1 sec and about 10 sec. Exemplary gaspulse lengths for precursor gases can be between 0.3 and 3 sec, forexample 1 sec. Exemplary gas pulse lengths for an oxygen-containing gas,a nitrogen-containing gas, and an oxygen- and nitrogen-containing gascan be between 0.3 and 3 sec, for example 1 sec. Exemplary purge gaspulses can be between 1 and 20 sec, for example 3 sec. An exemplarypulsed gas injection system is described in greater detail in pendingU.S. Patent Application Publication No. 2004/0123803.

Still referring to FIG. 4A, controller 70 can contain a microprocessor,memory, and a digital I/O port capable of generating control voltagessufficient to communicate and activate inputs to the processing system 1as well as monitor outputs from the processing system 1. Moreover, thecontroller 70 may be coupled to and may exchange information with theprocess chamber 10, substrate holder 20, upper assembly 30, firstprecursor supply system 40, second precursor supply system 42, purge gassupply system 44, oxygen-containing gas supply system 46,nitrogen-containing gas supply system 48, auxiliary gas supply system50, substrate temperature control system 60, substrate temperaturecontrol system 60, and pressure control system 32. For example, aprogram stored in the memory may be utilized to activate the inputs tothe aforementioned components of the deposition system 1 according to aprocess recipe in order to perform a deposition process.

However, the controller 70 may be implemented as a general purposecomputer system that performs a portion or all of the microprocessorbased processing steps of the invention in response to a processorexecuting one or more sequences of one or more instructions contained ina memory. Such instructions may be read into the controller memory fromanother computer readable medium, such as a hard disk or a removablemedia drive. One or more processors in a multi-processing arrangementmay also be employed as the controller microprocessor to execute thesequences of instructions contained in main memory. In alternativeembodiments, hard-wired circuitry may be used in place of or incombination with software instructions. Thus, embodiments are notlimited to any specific combination of hardware circuitry and software.

The controller 70 includes at least one computer readable medium ormemory, such as the controller memory, for holding instructionsprogrammed according to the teachings of the invention and forcontaining data structures, tables, records, or other data that may benecessary to implement the present invention. Examples of computerreadable media are compact discs, hard disks, floppy disks, tape,magneto-optical disks, PROMs (EPROM, EEPROM, flash EPROM), DRAM, SRAM,SDRAM, or any other magnetic medium, compact discs (e.g., CD-ROM), orany other optical medium, punch cards, paper tape, or other physicalmedium with patterns of holes, a carrier wave (described below), or anyother medium from which a computer can read.

Stored on any one or on a combination of computer readable media,resides software for controlling the controller 70, for driving a deviceor devices for implementing the invention, and/or for enabling thecontroller to interact with a human user. Such software may include, butis not limited to, device drivers, operating systems, development tools,and applications software. Such computer readable media further includesthe computer program product of the present invention for performing allor a portion (if processing is distributed) of the processing performedin implementing embodiments of the invention.

The computer code devices may be any interpretable or executable codemechanism, including but not limited to scripts, interpretable programs,dynamic link libraries (DLLs), Java classes, and complete executableprograms. Moreover, parts of the processing of the present invention maybe distributed for better performance, reliability, and/or cost.

The term “computer readable medium” as used herein refers to any mediumthat participates in providing instructions to the processor of thecontroller 70 for execution. A computer readable medium may take manyforms, including but not limited to, non-volatile media, volatile media,and transmission media. Non-volatile media includes, for example,optical, magnetic disks, and magneto-optical disks, such as the harddisk or the removable media drive. Volatile media includes dynamicmemory, such as the main memory. Moreover, various forms of computerreadable media may be involved in carrying out one or more sequences ofone or more instructions to processor of controller for execution. Forexample, the instructions may initially be carried on a magnetic disk ofa remote computer. The remote computer can load the instructions forimplementing all or a portion of the present invention remotely into adynamic memory and send the instructions over a network to thecontroller 70.

The controller 70 may be locally located relative to the processingsystem 1, or it may be remotely located relative to the processingsystem 1. For example, the controller 70 may exchange data with theprocessing system 1 using at least one of a direct connection, anintranet, the Internet and a wireless connection. The controller 70 maybe coupled to an intranet at, for example, a customer site (i.e., adevice maker, etc.), or it may be coupled to an intranet at, forexample, a vendor site (i.e., an equipment manufacturer). Additionally,for example, the controller 70 may be coupled to the Internet.Furthermore, another computer (i.e., controller, server, etc.) mayaccess, for example, the controller 70 to exchange data via at least oneof a direct connection, an intranet, and the Internet. As also would beappreciated by those skilled in the art, the controller 70 may exchangedata with the deposition system 1 via a wireless connection.

FIG. 4B illustrates a plasma processing system 100 for depositing firsthigh-k film 106, a second high-k film 110, and threshold voltageadjustment layer 108 on a substrate 102 according to another embodimentof the invention. The plasma processing system 100 may be configured forperforming PEALD or PECVD processing, in addition being able to performALD or CVD processing. The plasma processing system 100 is similar tothe processing system 1 described in FIG. 4A, but further includes aplasma generation system configured to generate a plasma during at leasta portion of the gas exposures in the process chamber 10. This allowsformation of ozone and plasma excited oxygen from an oxygen-containinggas containing O₂, H₂O, H₂O₂, or a combination thereof. Similarly,plasma excited nitrogen may be formed from a nitrogen-containing gascontaining N₂, NH₃, or N₂H₄, or C₁-C₁₀ alkylhydrazine compounds, or acombination thereof.

Also, plasma excited oxygen and nitrogen may be formed from a processgas containing NO, NO₂, and N₂O, or a combination thereof. The plasmageneration system includes a first power source 52 coupled to theprocess chamber 10, and configured to couple power to gases introducedinto the process chamber 10. The first power source 52 may be a variablepower source and may include a radio frequency (RF) generator and animpedance match network, and may further include an electrode throughwhich RF power is coupled to the plasma in process chamber 10. Theelectrode can be formed in the upper assembly 31, and it can beconfigured to oppose the substrate holder 20. The impedance matchnetwork can be configured to optimize the transfer of RF power from theRF generator to the plasma by matching the output impedance of the matchnetwork with the input impedance of the process chamber, including theelectrode, and plasma. For instance, the impedance match network servesto improve the transfer of RF power to plasma in process chamber 10 byreducing the reflected power. Match network topologies (e.g. L-type,π-type, T-type, etc.) and automatic control methods are well known tothose skilled in the art.

Alternatively, the first power source 52 may include a RF generator andan impedance match network, and may further include an antenna, such asan inductive coil, through which RF power is coupled to plasma inprocess chamber 10. The antenna can, for example, include a helical orsolenoidal coil, such as in an inductively coupled plasma source orhelicon source, or it can, for example, include a flat coil as in atransformer coupled plasma source.

Alternatively, the first power source 52 may include a microwavefrequency generator, and may further include a microwave antenna andmicrowave window through which microwave power is coupled to plasma inprocess chamber 10. The coupling of microwave power can be accomplishedusing electron cyclotron resonance (ECR) technology, or it may beemployed using surface wave plasma technology, such as a slotted planeantenna (SPA), as described in U.S. Pat. No. 5,024,716, the entirecontent of which is incorporated herein by reference.

According to one embodiment of the invention, the plasma processingsystem 100 includes a substrate bias generation system configured togenerate or assist in generating a plasma (through substrate holderbiasing) during at least a portion of the alternating introduction ofthe gases to the process chamber 10. The substrate bias system caninclude a substrate power source 54 coupled to the process chamber 10,and configured to couple power to the substrate 102. The substrate powersource 54 may include a RF generator and an impedance match network, andmay further include an electrode through which RF power is coupled tosubstrate 102. The electrode can be formed in substrate holder 20. Forinstance, substrate holder 20 can be electrically biased at a RF voltagevia the transmission of RF power from a RF generator (not shown) throughan impedance match network (not shown) to substrate holder 20. A typicalfrequency for the RF bias can range from about 0.1 MHz to about 100 MHz,and can be 13.56 MHz. RF bias systems for plasma processing are wellknown to those skilled in the art. Alternatively, RF power is applied tothe substrate holder electrode at multiple frequencies. Although theplasma generation system and the substrate bias system are illustratedin FIG. 4B as separate entities, they may indeed contain one or morepower sources coupled to substrate holder 20.

In addition, the plasma processing system 100 includes a remote plasmasystem 56 for providing and remotely plasma exciting anoxygen-containing gas, a nitrogen-containing gas, or a combinationthereof, prior to flowing the plasma excited gas into the processchamber 10 where it is exposed to the substrate 102. The remote plasmasystem 56 can, for example, contain a microwave frequency generator. Theprocess chamber pressure can be between about 0.1 Torr and about 10Torr, or between about 0.2 Torr and about 3 Torr.

A plurality of embodiments for forming a semiconductor device containinga buried threshold voltage adjustment layer have been disclosed invarious embodiments. The foregoing description of the embodiments of theinvention has been presented for the purposes of illustration anddescription. It is not intended to be exhaustive or to limit theinvention to the precise forms disclosed. This description and theclaims following include terms that are used for descriptive purposesonly and are not to be construed as limiting. For example, the term “on”as used herein (including in the claims) does not require that a film“on” a substrate is directly on and in immediate contact with thesubstrate; there may be a second film or other structure between thefilm and the substrate.

Persons skilled in the relevant art can appreciate that manymodifications and variations are possible in light of the aboveteaching. Persons skilled in the art will recognize various equivalentcombinations and substitutions for various components shown in theFigures. It is therefore intended that the scope of the invention belimited not by this detailed description, but rather by the claimsappended hereto.

1. A method of forming a semiconductor device, the method comprising:providing a substrate containing an interface layer thereon; depositinga first high-k film on the interface layer, the first high-k filmcomprising hafnium oxide, zirconium oxide, hafnium silicate, orzirconium silicate, or a combination thereof; depositing ametal-containing oxide threshold voltage adjustment layer on the firsthigh-k film, wherein the metal-containing oxide threshold voltageadjustment layer comprises one or more elements selected from Group II,Group III, Group XIII, and rare earth metals of the Periodic Table ofthe Elements, or selected from a combination of two or more thereof;depositing a second high-k film on the metal-containing oxide thresholdvoltage adjustment layer such that the metal-containing oxide thresholdvoltage adjustment layer is interposed between the first and secondhigh-k films, the second high-k film comprising hafnium oxide, hafniumsilicate, zirconium oxide, or zirconium silicate, or a combination oftwo or more thereof; and performing a heat-treating process followingdeposition of the metal-containing oxide threshold voltage adjustmentlayer, following deposition of the second high-k film, followingdeposition of a gate electrode, or following formation of a gate stack,the performing the heat-treating process including performing theheat-treating process to diffuse elements of the metal-containing oxidethreshold voltage adjustment layer into the first high-k film on theinterface layer.
 2. The method of claim 1, further comprising:depositing the gate electrode on the second high-k film; and forming thegate stack by performing a patterning process to the first high-k film,the metal-containing oxide threshold voltage adjustment layer, thesecond high-k film and the gate electrode.
 3. The method of claim 1,wherein the second high-k film further comprises one or more elementsselected from Group II, Group III, Group XIII, and rare earth metals ofthe Periodic Table of the Elements, or selected from a combination oftwo or more thereof.
 4. The method of claim 1, wherein each of the firstand second high-k films comprises hafnium but not zirconium, orcomprises zirconium but not hafnium.
 5. The method of claim 1, whereineach of the first and second high-k films comprises hafnium oxide,hafnium oxynitride, hafnium silicate, hafnium silicon oxynitride,zirconium oxide, zirconium oxynitride, zirconium silicate, zirconiumsilicon oxynitride, hafnium zirconium oxide, hafnium zirconiumoxynitride, hafnium zirconium silicate, or hafnium zirconium siliconoxynitride, or a combination of two or more thereof.
 6. The method ofclaim 1, wherein the metal-containing oxide threshold voltage adjustmentlayer further comprises hafnium, zirconium, or hafnium and zirconium. 7.The method of claim 1, wherein each of the first high-k film, the secondhigh-k film, and the threshold voltage adjustment layer compriseshafnium but not zirconium or comprises zirconium but not hafnium.
 8. Themethod of claim 1, wherein the second high-k film has a higherdielectric constant than the first high-k film.
 9. The method of claim1, wherein the metal-containing oxide threshold voltage adjustment layercomprises an oxide, oxynitride, or titanate layer containing beryllium(Be), magnesium (Mg), calcium (Ca), strontium (Sr), barium (Ba),scandium (Sc), boron (B), aluminum (Al), gallium (Ga), indium (In),silicon (Si), yttrium (Y), lutetium (Lu), lanthanum (La), cerium (Ce),praseodymium (Pr), neodymium (Nd), samarium (Sm), europium (Eu),gadolinium (Gd), terbium (Tb), dysprosium (Dy), holmium (Ho), erbium(Er), thulium (Tm), or ytterbium (Yb), or a combination of two or morethereof.
 10. A method of forming a semiconductor device, the methodcomprising: providing a substrate containing an interface layer thereon;depositing a first high-k film on the interface layer, the first high-kfilm comprising hafnium oxide, zirconium oxide, hafnium silicate, orzirconium silicate, or a combination thereof; depositing ametal-containing oxide threshold voltage adjustment layer on the firsthigh-k film, wherein the metal-containing oxide threshold voltageadjustment layer comprises one or more elements selected from Group II,Group III, Group XIII, and rare earth metals of the Periodic Table ofthe Elements, or selected from a combination of two or more thereof;depositing a second high-k film on the metal-containing oxide thresholdvoltage adjustment layer such that the metal-containing oxide thresholdvoltage adjustment layer is interposed between the first and secondhigh-k films; and performing a heat-treating process followingdeposition of the metal-containing oxide threshold voltage adjustmentlayer, following deposition of the second high-k film, followingdeposition of a gate electrode, or following formation of a gate stack,and the performing the heat-treating process includes performing theheat-treating process to diffuse elements of the metal-containing oxidethreshold voltage adjustment layer into the first high-k film on theinterface layer and the second high-k film.